Invention Grant
US07690103B2 Method of forming a printed circuit board with improved via design
失效
形成具有改进的通孔设计的印刷电路板的方法
- Patent Title: Method of forming a printed circuit board with improved via design
- Patent Title (中): 形成具有改进的通孔设计的印刷电路板的方法
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Application No.: US11868148Application Date: 2007-10-05
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Publication No.: US07690103B2Publication Date: 2010-04-06
- Inventor: Alan E. Wang , Kevin C. Olson
- Applicant: Alan E. Wang , Kevin C. Olson
- Applicant Address: US OH Cleveland
- Assignee: PPG Industries Ohio, Inc.
- Current Assignee: PPG Industries Ohio, Inc.
- Current Assignee Address: US OH Cleveland
- Agent Deborah M. Altman; Diane R. Meyers
- Main IPC: H05K3/36
- IPC: H05K3/36

Abstract:
A circuit board includes an electrically conductive sheet having an insulative coating surrounding the conductive sheet, with a surface of the insulative coating around an edge of the conductive sheet having an arcuate or rounded shape. At least one electrical conductor is conformally deposited on at least the rounded insulative coating around the edge of the conductive sheet and defined via photolithographic and metallization techniques. Each electrical conductor on the insulative coating thereon around the edge of the conductive sheet conforms to the arcuate or rounded shape of the insulative coating and, therefore, has an arcuate or rounded shape.
Public/Granted literature
- US20080022523A1 Method of Forming a Printed Circuit Board With Improved Via Design Public/Granted day:2008-01-31
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