Invention Grant
- Patent Title: Ceramic header method
- Patent Title (中): 陶瓷头法
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Application No.: US11586366Application Date: 2006-10-25
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Publication No.: US07690106B2Publication Date: 2010-04-06
- Inventor: Moody K. Forgey , Mark A. Kressley
- Applicant: Moody K. Forgey , Mark A. Kressley
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Charles A. Brill; Wade James Brady, III; Frederick J. Telecky, Jr.
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H01L21/00
Abstract:
A ceramic header configured to form a portion of an electronic device package includes a mounting portion configured to provide a mounting surface for an electronic device. In addition, the ceramic header includes one or more conductive input-output connectors operable to provide electrical connections from a first surface of the ceramic header to a second surface of the ceramic header. The ceramic header also includes one or more thermally polished surfaces.
Public/Granted literature
- US20080099240A1 Ceramic header method and system Public/Granted day:2008-05-01
Information query
