Invention Grant
- Patent Title: Method for aligning and installing flexible circuit interconnects
- Patent Title (中): 对准和安装柔性电路互连的方法
-
Application No.: US11763879Application Date: 2007-06-15
-
Publication No.: US07690107B2Publication Date: 2010-04-06
- Inventor: Peter Timothy Heisen , Harold Peter Soares, Jr.
- Applicant: Peter Timothy Heisen , Harold Peter Soares, Jr.
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Yee & Associates, P.C.
- Agent Kevin G. Fields
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H01R12/00

Abstract:
A method and apparatus for aligning components on a module. A flexible circuit may be attached to a module in which a tooling apparatus is attached to the module. A plurality of circuit pads on a functional section of the flexible circuit is aligned by a first alignment structure located on a sacrificial portion of the flexible circuit to a second alignment structure on the tooling apparatus. The flexible circuit is attached to the module while the flexible circuit is in an aligned position.
Public/Granted literature
- US20080310125A1 METHOD AND APPARATUS FOR ALIGNING AND INSTALLING FLEXIBLE CIRCUIT INTERCONNECTS Public/Granted day:2008-12-18
Information query