A method for making plural plated through holes in a single circuit board via is provided. The method includes plating copper in the walls of said circuit board via to form a first plated through hole and applying a thin layer of first adhesive promotor to the surface of said plated via. The method further includes vacuum depositing an organic layer having a high dielectric strength unto said layer of first adhesive promoter and applying a second layer of adhesive promoter over said organic layer. The method even further includes plating copper over said second layer of adhesive promoter to form a second plated through hole in said circuit board via.