Invention Grant
- Patent Title: Method of making a micro-fluid ejection device
- Patent Title (中): 制造微流体喷射装置的方法
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Application No.: US11386174Application Date: 2006-03-22
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Publication No.: US07690115B2Publication Date: 2010-04-06
- Inventor: Mary C. Smoot , Paul T. Spivey , Melissa M. Waldeck , Craig M. Bertelsen , Sean T. Weaver
- Applicant: Mary C. Smoot , Paul T. Spivey , Melissa M. Waldeck , Craig M. Bertelsen , Sean T. Weaver
- Applicant Address: US KY Lexington
- Assignee: Lexmark International, Inc.
- Current Assignee: Lexmark International, Inc.
- Current Assignee Address: US KY Lexington
- Main IPC: B21D53/76
- IPC: B21D53/76 ; B32B38/14

Abstract:
A method is provided for making a multi-fluid cartridge for holding multiple fluids in segregated containment localities. The cartridge body contains fluid supply paths in fluid flow communication with the containment localities. A nozzle plate is attached to a device side of each of a plurality of defined ejection head substrates on a semiconductor wafer. Each of the ejection head substrates has a fluid supply side and two or more fluid flow paths therein for supplying fluid from the supply side to the device side thereof. The fluid flow paths in the ejection head substrates have a flow path density of greater than about 1.0 flow paths per millimeter. The wafer is diced to provide a plurality of micro-fluid ejection device structures. A circuit device is attached to the device side of each of the substrates. An adhesive is stencil printed with a bond line density of at least about 1.2 mm−1 on the micro-fluid ejection device structures or on the cartridge body. At least one of the micro-fluid ejection device structures and attached circuit is adhesively bonded to the cartridge body for flow of fluid from the containment localities to the device side thereof.
Public/Granted literature
- US20060213060A1 Die attach methods and apparatus for micro-fluid ejection device Public/Granted day:2006-09-28
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