Invention Grant
- Patent Title: Refrigeration system, compressing and heat-releasing apparatus and heat-releasing device
- Patent Title (中): 制冷系统,压缩和放热装置和散热装置
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Application No.: US10531705Application Date: 2003-10-24
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Publication No.: US07690217B2Publication Date: 2010-04-06
- Inventor: Koichiro Take , Etsuo Shinmura , Yuichi Furukawa
- Applicant: Koichiro Take , Etsuo Shinmura , Yuichi Furukawa
- Applicant Address: JP Tokyo
- Assignee: Showa Denko K.K.
- Current Assignee: Showa Denko K.K.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2002-309103 20021024
- International Application: PCT/JP03/13614 WO 20031024
- International Announcement: WO2004/038307 WO 20040506
- Main IPC: F25B1/00
- IPC: F25B1/00

Abstract:
A refrigeration system including a two-stage type compressor having independent low-pressure and high-pressure compressing portions, a heat-releasing device having independent primary and secondary heat-releasing paths, an expansion valve and a cooler. The refrigerant primarily compressed by the low-pressure compressing portion is primarily released in heat by the primary heat-releasing path. The primarily heat-released refrigerant is secondarily compressed by the high-pressure compressing portion. The secondarily compressed refrigerant is secondarily released in heat by the secondary heat-releasing path to thereby obtain a low-temperature and high-pressure refrigerant. The low-temperature and high-pressure refrigerant is decompressed and expanded by an expansion valve and passes through the cooler to absorb the heat in a room air, and then returns to the low-pressure compressing portion of the compressor. In this system, the refrigerant temperature during the heat-releasing procedure can be kept low.
Public/Granted literature
- US20060137385A1 Refrigeration system, compressing and heat-releasing apparatus and heat-releasing device Public/Granted day:2006-06-29
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