Invention Grant
US07690578B2 Wireless IC tag joining method, wireless IC tag-carrying article, and vehicle
失效
无线IC标签接合方法，无线IC标签携带物品和车辆
- Patent Title: Wireless IC tag joining method, wireless IC tag-carrying article, and vehicle
- Patent Title (中): 无线IC标签接合方法，无线IC标签携带物品和车辆
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Application No.: US10569456Application Date: 2004-08-25
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Publication No.: US07690578B2Publication Date: 2010-04-06
- Inventor: Wakahiro Kawai
- Applicant: Wakahiro Kawai
- Applicant Address: JP Kyoto
- Assignee: Omron Corporation
- Current Assignee: Omron Corporation
- Current Assignee Address: JP Kyoto
- Agency: Dickstein Shapiro LLP
- Priority: JP2003-306530 20030829; JP2004-225450 20040802
- International Application: PCT/JP2004/012213 WO 20040825
- International Announcement: WO2005/021292 WO 20050310
- Main IPC: G06K19/06
- IPC: G06K19/06
Abstract:
A flat IC tag contains memory means capable of data storage and transmission means capable of data transmission. The IC tag has on a surface thereof an unvulcanized rubber having identical properties to the unvulcanized rubber used for an article to which the IC tag is mounted. The opposite surface of the IC tag is mounted to the article before vulcanization. The article is vulcanized in this state to mount the IC tag to the article. Hence, the IC tag is not damaged if attached to tires and other articles in harsh operating environment.
Public/Granted literature
- US20060164250A1 Wireless ic tag joining method, wireless ic tag-carrying article, and vehicle Public/Granted day:2006-07-27
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