Invention Grant
- Patent Title: Liquid ejecting head and liquid ejecting apparatus
- Patent Title (中): 液体喷头和液体喷射装置
-
Application No.: US11699715Application Date: 2007-01-30
-
Publication No.: US07690768B2Publication Date: 2010-04-06
- Inventor: Takeo Eguchi , Shogo Ono , Takaaki Miyamoto , Kazuyasu Takenaka
- Applicant: Takeo Eguchi , Shogo Ono , Takaaki Miyamoto , Kazuyasu Takenaka
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rockey, Depke & Lyons, LLC
- Agent Robert J. Depke
- Priority: JP2006-025496 20060202
- Main IPC: B41J2/05
- IPC: B41J2/05

Abstract:
A liquid ejecting head includes a plurality of liquid ejecting portions arrayed in a flat region on a substrate. The liquid ejecting portions each include a liquid chamber that accommodates liquid to be ejected, a heater element arranged in the liquid chamber, the heater element generating bubbles in liquid in the liquid chamber when heated, and a nozzle for ejecting liquid in the liquid chamber in accordance with generation of bubbles by the heater element.
Public/Granted literature
- US20070188561A1 Liquid ejecting head and liquid ejecting apparatus Public/Granted day:2007-08-16
Information query
IPC分类: