Invention Grant
- Patent Title: Platen and liquid ejecting apparatus
- Patent Title (中): 压板和液体喷射装置
-
Application No.: US11524283Application Date: 2006-09-21
-
Publication No.: US07690784B2Publication Date: 2010-04-06
- Inventor: Nobuyuki Nishi , Seiji Kawabata , Kazuhiro Hashii , Kazumasa Harada , Keiichiro Fukumasu , Hirohisa Adachi
- Applicant: Nobuyuki Nishi , Seiji Kawabata , Kazuhiro Hashii , Kazumasa Harada , Keiichiro Fukumasu , Hirohisa Adachi
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPP2005-273786 20050921
- Main IPC: B41J2/01
- IPC: B41J2/01
Abstract:
A plate-shaped main body, has a first face formed with a recess portion defined by a bottom face and side walls and a second face which is opposite to the first face. The plate-shaped main body is formed with a through hole connecting the bottom face and the second face. An overhanging portion, is provided on at least one of the side walls in the vicinity of the first face, and is located so as to at least partially hang over the through hole.
Public/Granted literature
- US20070064078A1 Platen and liquid ejecting apparatus Public/Granted day:2007-03-22
Information query
IPC分类:
