Invention Grant
- Patent Title: Thermal properties measurement apparatus
- Patent Title (中): 热性能测量仪器
-
Application No.: US11110701Application Date: 2005-04-21
-
Publication No.: US07690838B2Publication Date: 2010-04-06
- Inventor: Chikayoshi Sumi
- Applicant: Chikayoshi Sumi
- Agency: Sughrue Mion, PLLC
- Main IPC: G01K3/08
- IPC: G01K3/08 ; G01K25/18 ; G06F17/10 ; G06F17/13 ; G01K25/20

Abstract:
A thermal property measurement apparatus capable of directly measuring thermal conductivity distribution in a ROI within a target only by measuring the temperature distribution that already exists in the ROI without generating other temperature fields artificially. The thermal property measurement apparatus includes a temperature detector for measuring temperatures at plural positions in the ROI, a distance controller for controlling a distance between the temperature detector and the target, a scanner for changing a relative position therebetween, a stage for putting the object thereon, a recorder for recording measured temperature data, position data and time data, a determination unit for determining whether at least one of thermal conductive phenomena and convection phenomena is dealt with or not, a processor for calculating thermal conductivity distribution in the ROI from the recorded data and temporal changeable references of the thermal conductivity in the ROI, and a controller.
Public/Granted literature
- US20060239328A1 Thermal properties measurement apparatus Public/Granted day:2006-10-26
Information query