Invention Grant
- Patent Title: Thermal testing apparatus
- Patent Title (中): 热测试仪
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Application No.: US11842165Application Date: 2007-08-21
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Publication No.: US07690839B2Publication Date: 2010-04-06
- Inventor: Zhen-Xing Ye , Ke Sun , Xiao-Zhu Chen , Ming-Ke Chen
- Applicant: Zhen-Xing Ye , Ke Sun , Xiao-Zhu Chen , Ming-Ke Chen
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Agent Frank R. Niranjan
- Main IPC: G01N3/60
- IPC: G01N3/60 ; G01N25/00 ; G01K7/00

Abstract:
A thermal testing apparatuses for a server system (22) includes a heating module (16), at least one temperature sensor (191), a micro control unit (MCU) (192), a trigger controlling circuit (193) and a display module (20). The heating module heats airflow at an entry of the server system. The temperature sensor senses temperature at the entry of the server system, and outputs temperature signals. The MCU receives temperature signals and converts them to temperatures in degrees. The trigger controlling circuit is electrically connected to the MCU to receive a controlling signal, and controls turning the heating module on or off. The display module is electrically connected to the MCU for showing the temperatures in degrees.
Public/Granted literature
- US20090052495A1 THERMAL TESTING APPARATUS Public/Granted day:2009-02-26
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