Invention Grant
- Patent Title: Failsafe mechanism for preventing an integrated circuit from overheating
- Patent Title (中): 防止集成电路过热的故障安全机制
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Application No.: US11906406Application Date: 2007-10-01
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Publication No.: US07690843B2Publication Date: 2010-04-06
- Inventor: Scott J. Bowden , Jonathan P. Douglas
- Applicant: Scott J. Bowden , Jonathan P. Douglas
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: G01K7/42
- IPC: G01K7/42 ; G01K3/04 ; H03K3/01 ; G06F1/26 ; G01F1/07

Abstract:
Techniques for preventing an integrated circuit (IC) from overheating are described herein. According to one embodiment, an exemplary process includes detecting whether a temperature of an integrated circuit (IC) exceeds a threshold independent of an operating state of the IC, and removing at least a portion of a power from the IC if the temperature of the IC exceeds the threshold. Other methods and apparatuses are also described.
Public/Granted literature
- US20080031303A1 Failsafe mechanism for preventing an integrated circuit from overheating Public/Granted day:2008-02-07
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