Invention Grant
- Patent Title: Fluid bearing device
- Patent Title (中): 流体轴承装置
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Application No.: US10557257Application Date: 2004-07-09
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Publication No.: US07690845B2Publication Date: 2010-04-06
- Inventor: Fuminori Satoji , Kenji Itou
- Applicant: Fuminori Satoji , Kenji Itou
- Applicant Address: JP Osaka
- Assignee: NTN Corporation
- Current Assignee: NTN Corporation
- Current Assignee Address: JP Osaka
- Agency: Arent Fox LLP
- Priority: JP2003-278414 20030723
- International Application: PCT/JP2004/010177 WO 20040709
- International Announcement: WO2005/008088 WO 20050127
- Main IPC: F16C32/06
- IPC: F16C32/06

Abstract:
An object is to reduce manufacturing cost of a housing, and enable to disuse an adhesive in fixation portions between a housing and a bearing sleeve and the like.A housing 7 is made of resin material, which comprises a liquid crystal polymer (LCP) as crystalline resin blended with carbon nanotubes in a blending ratio of 2 to 35 vol % as a conductive filler, by injection molding. A bearing sleeve 8, which is inserted into the inner peripheral surface 7c of the housing 7, is secured to the housing 7 by ultrasonic welding.
Public/Granted literature
- US20070058889A1 Fluid bearing device Public/Granted day:2007-03-15
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