Invention Grant
- Patent Title: Substrate processing apparatus
- Patent Title (中): 基板加工装置
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Application No.: US11623231Application Date: 2007-01-15
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Publication No.: US07690853B2Publication Date: 2010-04-06
- Inventor: Tetsuya Hamada
- Applicant: Tetsuya Hamada
- Applicant Address: JP Kyoto
- Assignee: Sokudo Co., Ltd.
- Current Assignee: Sokudo Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Townsend and Townsend and Crew LLP
- Priority: JP2006-016464 20060125
- Main IPC: G03D5/00
- IPC: G03D5/00 ; G03B27/32 ; B08B3/00

Abstract:
A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, and an interface block. An exposure device is arranged adjacent to the interface block. The interface block includes a substrate replacement group. The substrate replacement group has a stack of three cleaning/drying processing units. The cleaning/drying processing unit subjects the substrate after exposure processing to cleaning and drying processing.
Public/Granted literature
- US20070172233A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2007-07-26
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