Invention Grant
- Patent Title: Modular jack with cooling slots
- Patent Title (中): 带冷却槽的模块化插座
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Application No.: US12359640Application Date: 2009-01-26
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Publication No.: US07690941B2Publication Date: 2010-04-06
- Inventor: Jack E. Caveney , Ronald A. Nordin
- Applicant: Jack E. Caveney , Ronald A. Nordin
- Applicant Address: US IL Tinley Park
- Assignee: Panduit Corp.
- Current Assignee: Panduit Corp.
- Current Assignee Address: US IL Tinley Park
- Agent Robert A. McCann; Zachary J. Smolinski
- Main IPC: H01R13/00
- IPC: H01R13/00

Abstract:
An active jack, which is a powered device, is installed as the network connection at a workstation which provides the capability to determine the physical location of a destination device, such as a VOIP phone, in real time. Uninterruptible power supplies may be used to provide power to network components, for example during an emergency. Power-and-data deployments are shown for powering network components and destination devices.
Public/Granted literature
- US20090137159A1 Patch panel with a motherboard for connecting communications jacks Public/Granted day:2009-05-28
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