Invention Grant
- Patent Title: Electrical connector with improved grounding structure
- Patent Title (中): 电连接器具有改进的接地结构
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Application No.: US12156058Application Date: 2008-05-28
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Publication No.: US07690947B2Publication Date: 2010-04-06
- Inventor: Hao Gu , Qi-Sheng Zheng , Zhi-Quan Mou , Jie Cai
- Applicant: Hao Gu , Qi-Sheng Zheng , Zhi-Quan Mou , Jie Cai
- Applicant Address: TW Taipei Hsien
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Agent Wei Te Chung; Andrew C. Cheng; Ming Chieh Chang
- Main IPC: H01R13/648
- IPC: H01R13/648

Abstract:
An electrical connector (100) for mating with a corresponding plug (200) includes a dielectric housing (1) defining two contact areas (15) along an up to down direction. An outer shield (3) encloses the dielectric housing. A plurality of contacts (2) are retained in the contact areas. An inner shield (4) are mounted between two contact areas and comprises a pair of spring arms (42) extending into the contact area to lock with the plug and a resilient strip (43) extending into the contact areas to abutting against an outer side of the plug.
Public/Granted literature
- US20080299828A1 Electrical connector with improved grounding structure Public/Granted day:2008-12-04
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