Invention Grant
- Patent Title: Granular metal powder
- Patent Title (中): 颗粒状金属粉末
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Application No.: US10575898Application Date: 2004-06-24
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Publication No.: US07691175B2Publication Date: 2010-04-06
- Inventor: Kohei Shimoda , Issei Okada , Masatoshi Majima
- Applicant: Kohei Shimoda , Issei Okada , Masatoshi Majima
- Applicant Address: JP Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2003-354459 20031015
- International Application: PCT/JP2004/009309 WO 20040624
- International Announcement: WO2005/037464 WO 20050428
- Main IPC: B22F1/00
- IPC: B22F1/00 ; B22F9/24

Abstract:
When fine metal particles of a nanometer size are handled in a state of colloidal particles, it is difficult to handle them and the range of the selection of the solvent to be used is limited. The invention offers a granular metal powder that is produced by the steps of (a) preparing a suspension liquid comprising (a1) water, an organic solvent, or a mixture thereof, (a2) metal particles having an average particle diameter of at least 1 nm and at most 100 nm, and (a3) an organic compound capable of being adsorbed on the surface of the metal particles and (b) removing the water, organic solvent, or mixture thereof by drying the suspension liquid and that has an apparent density of at least 1.0 g/ml and at most 5.0 g/ml. The granular metal powder can be handled as a dry metal powder and is readily redispersed in a solvent.
Public/Granted literature
- US20070074598A1 Granular metal powder Public/Granted day:2007-04-05
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