Invention Grant
- Patent Title: Printed wiring board and its manufacturing method
- Patent Title (中): 印刷电路板及其制造方法
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Application No.: US11736495Application Date: 2007-04-17
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Publication No.: US07691189B2Publication Date: 2010-04-06
- Inventor: Honchin En , Tohru Nakai , Takeo Oki , Naohiro Hirose , Kouta Noda
- Applicant: Honchin En , Tohru Nakai , Takeo Oki , Naohiro Hirose , Kouta Noda
- Applicant Address: JP Gifu
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP Gifu
- Agency: Sughrue Mion, PLLC
- Priority: JP10-259854 19980914; JP10-283435 19980917; JP10-288925 19980924; JP10-331200 19981120; JP10-334499 19981125; JP10-362962 19981221; JP11-95916 19990402
- Main IPC: C23C18/40
- IPC: C23C18/40 ; B05D1/18
Abstract:
The present invention is directed to a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity, and by which uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.
Public/Granted literature
- US20070266886A1 PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD Public/Granted day:2007-11-22
Information query
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