Invention Grant
- Patent Title: Film formation apparatus and methods including temperature and emissivity/pattern compensation
- Patent Title (中): 成膜装置及方法，包括温度和发射率/图案补偿
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Application No.: US11242298Application Date: 2005-09-30
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Publication No.: US07691204B2Publication Date: 2010-04-06
- Inventor: Juan Chacin , Aaron Hunter , Craig Metzner , Roger N. Anderson
- Applicant: Juan Chacin , Aaron Hunter , Craig Metzner , Roger N. Anderson
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Diehl Servilla LLC
- Agent Scott S. Servilla, Esq.
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23C16/46 ; C23C16/52 ; H01L21/306
Abstract:
A film formation system 10 has a processing chamber 15 bounded by sidewalls 18 and a top cover 11. In one embodiment, the top cover 11 has a reflective surface 13 for reflecting radiant energy back onto a substrate 19, pyrometers 405 for measuring the temperature of the substrate 19 across a number of zones, and at least one emissometer 410 for measuring the actual emissivity of the substrate 19. In another embodiment, a radiant heating system 313 is disposed under the substrate support 16. The temperature of the substrate 19 is obtained from pyrometric data from the pyrometers 405, and the emissometer 410.
Public/Granted literature
- US20070077355A1 Film formation apparatus and methods including temperature and emissivity/pattern compensation Public/Granted day:2007-04-05
Information query
IPC分类:
