A molding apparatus comprises an upper molding box, a lower mold box, an upper flexible membrane covering an opening of the upper mold box, a lower flexible membrane covering an opening of the lower mold box, a heating system located in the upper mold box, a set of ports located between the upper flexible membrane and the lower flexible membrane capable of being used to draw a vacuum between the upper flexible membrane and the lower flexible membrane, and a displacement system located in the lower mold box under the lower flexible membrane.