Invention Grant
US07691313B2 Method for expelling gas positioned between a substrate and a mold
有权
用于排出位于基底和模具之间的气体的方法
- Patent Title: Method for expelling gas positioned between a substrate and a mold
- Patent Title (中): 用于排出位于基底和模具之间的气体的方法
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Application No.: US11565393Application Date: 2006-11-30
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Publication No.: US07691313B2Publication Date: 2010-04-06
- Inventor: Byung-Jin Choi , Sidlgata V. Sreenivasan , Ian M. McMackin , Pankaj B. Lad
- Applicant: Byung-Jin Choi , Sidlgata V. Sreenivasan , Ian M. McMackin , Pankaj B. Lad
- Applicant Address: US TX Austin
- Assignee: Molecular Imprints, Inc.
- Current Assignee: Molecular Imprints, Inc.
- Current Assignee Address: US TX Austin
- Agent Laura C. Robinson
- Main IPC: B29D11/00
- IPC: B29D11/00
Abstract:
The present invention is directed towards a method and a system of expelling a gas positioned between a substrate and a mold, the substrate and the mold further having a liquid positioned therebetween.
Public/Granted literature
- US20070114686A1 METHOD FOR EXPELLING GAS POSITIONED BETWEEN A SUBSTRATE AND A MOLD Public/Granted day:2007-05-24
Information query
