Invention Grant
- Patent Title: Method and installation for the densification of substrates by means of chemical vapor infiltration
- Patent Title (中): 通过化学气相渗透使基材致密化的方法和安装
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Application No.: US10475464Application Date: 2003-01-14
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Publication No.: US07691440B2Publication Date: 2010-04-06
- Inventor: Bruno Bernard , Stéphane Goujard , Sébastien Bertrand
- Applicant: Bruno Bernard , Stéphane Goujard , Sébastien Bertrand
- Applicant Address: FR Le Haillan
- Assignee: SNECMA Propulsion Solide
- Current Assignee: SNECMA Propulsion Solide
- Current Assignee Address: FR Le Haillan
- Agency: Weingarten, Schurgin, Gagnebin & Lebovici LLP
- Priority: FR0200412 20020115
- International Application: PCT/FR03/00097 WO 20030114
- International Announcement: WO03/060183 WO 20030724
- Main IPC: C23C16/00
- IPC: C23C16/00

Abstract:
A method of densifying porous substrates by chemical vapor infiltration comprises loading porous substrates for densification in a loading zone of an enclosure (10), heating the internal volume of the enclosure, and introducing a reagent gas into the enclosure though an inlet situated at one end of the enclosure. Before coming into contact with substrates (20) situated in the loading zone, the reagent gas admitted into the enclosure is preheated, at least in part, by passing along a duct (30) connected to the gas inlet and extending through the loading zone, the duct being raised to the temperature inside the enclosure, and the preheated reagent gas is distributed in the loading zone through one or more openings (33) formed in the side wall (32) of the duct, along the duct.
Public/Granted literature
- US20040237898A1 Method and installation for the densification of substrates by means of chemical bapour infiltration Public/Granted day:2004-12-02
Information query
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