Invention Grant
- Patent Title: Ceramic multilayer substrate and method for manufacturing the same
- Patent Title (中): 陶瓷多层基板及其制造方法
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Application No.: US12049848Application Date: 2008-03-17
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Publication No.: US07691469B2Publication Date: 2010-04-06
- Inventor: Masato Nomiya
- Applicant: Masato Nomiya
- Applicant Address: JP
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP
- Agency: Dickstein, Shapiro, LLP.
- Priority: JP2005-270703 20050916
- Main IPC: B32B9/00
- IPC: B32B9/00

Abstract:
A ceramic multilayer substrate exhibiting reduced pealing and breakage of an internal conductor disposed between a ceramic layer serving as a base member and a ceramic layer for restricting shrinkage includes a first ceramic layer 11, a second ceramic layer 12 laminated so as to come into contact with a principal surface of the first ceramic layer 11, and an internal conductor 13 disposed between the first ceramic layer 11 and the second ceramic layer 12, a phosphorus component layer 16a is disposed in the first ceramic layer 11 with a concentration gradient in which the concentration decreases in a direction away from the internal conductor 13.
Public/Granted literature
- US20080156413A1 CERAMIC MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2008-07-03
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