The present invention provides electrodeposited copper foil with a carrier foil which permits the formation of finer-pitch circuits and also enables the multilayer process to be easily performed to meet the requirements for recent printed wiring boards. According to the invention, there is provided electrodeposited copper foil with a carrier foil in which an adhesive interface layer is formed on a surface of the carrier foil and an electrodeposited copper foil layer is formed on the adhesive interface layer, which is characterized in that the electrodeposited copper foil layer is provided with a passivated layer formed without performing roughening treatment as nodular treatment and that a nickel-zinc alloy consisting essentially of 50 to 99% nickel by weight and 50 to 1% zinc by weight is adopted as the passivated layer.