Invention Grant
- Patent Title: Optical module producing method and apparatus
- Patent Title (中): 光模块的制造方法和装置
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Application No.: US11703699Application Date: 2007-02-08
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Publication No.: US07691662B2Publication Date: 2010-04-06
- Inventor: Toru Okada , Masanao Fujii , Yutaka Noda
- Applicant: Toru Okada , Masanao Fujii , Yutaka Noda
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2006-291992 20061027
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
An optical module is produced by coating, with respect to a substrate having a substrate surface provided with terminal pads and landing pads a solder material on the terminal pads, mounting an optical element package having terminals and a flat top surface on the substrate using the landing pads so that the top surface becomes approximately parallel to the substrate surface and a gap is formed between a bottom surface of the optical element package and the substrate surface, preheating the terminal pads simultaneously as the mounting, and electrically connecting the terminal pads to corresponding terminals of the optical element package by melting the solder material and thereafter hardening the solder material.
Public/Granted literature
- US20080102544A1 Optical module producing method and apparatus Public/Granted day:2008-05-01
Information query
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