Invention Grant
- Patent Title: Electronic parts packaging structure and method of manufacturing the same
- Patent Title (中): 电子零件包装结构及制造方法相同
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Application No.: US11524933Application Date: 2006-09-22
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Publication No.: US07691673B2Publication Date: 2010-04-06
- Inventor: Masahiro Sunohara , Kei Murayama , Toshinori Koyama , Kazutaka Kobayashi , Mitsutoshi Higashi
- Applicant: Masahiro Sunohara , Kei Murayama , Toshinori Koyama , Kazutaka Kobayashi , Mitsutoshi Higashi
- Applicant Address: JP Nagano-shi
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano-shi
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2003-035156 20030213
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
An electronic parts packaging structure of the present invention includes a wiring substrate having a wiring pattern, a first insulating film which is formed on the wiring substrate and which has an opening portion in a packaging area where an electronic parts is mounted, the electronic parts having a connection terminal flip-chip mounted on the wiring pattern exposed in the opening portion of the first insulating film, a second insulating film for covering the electronic parts, a via hole formed in a predetermined portion of the first and second insulating films on the wiring pattern, and an upper wiring pattern formed on the second insulating film and connected to the wiring pattern through the via hole.
Public/Granted literature
- US20070013048A1 Electronic parts packaging structure and method of manufacturing the same Public/Granted day:2007-01-18
Information query
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