Invention Grant
- Patent Title: Integrated circuit packaging system with stacked device and method of manufacturing thereof
- Patent Title (中): 具有堆叠装置的集成电路封装系统及其制造方法
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Application No.: US12488557Application Date: 2009-06-20
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Publication No.: US07691674B1Publication Date: 2010-04-06
- Inventor: Henry Descalzo Bathan , Zigmund Ramirez Camacho , Jairus Legaspi Pisigan
- Applicant: Henry Descalzo Bathan , Zigmund Ramirez Camacho , Jairus Legaspi Pisigan
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/02
Abstract:
A method of manufacture of an integrated circuit packaging system includes: forming a first lead, having a first body and a first tip, and a paddle, having a protrusion at a side of the paddle, with the first body adjacent to the protrusion; forming a second lead having a second body and a second tip adjacent to the paddle; attaching a device, having a device active side, to the paddle and adjacent to the protrusion; mounting a component, having a component active side, to the device with the component active side facing the device active side and between the second body and the first tip; connecting the component and the second body; and forming an encapsulation covering the device, and partially covering the paddle, the component, the first lead, and the second lead.
Information query
IPC分类:
