Invention Grant
- Patent Title: Encapsulating electrical connections
- Patent Title (中): 封装电气连接
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Application No.: US11257273Application Date: 2005-10-24
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Publication No.: US07691675B2Publication Date: 2010-04-06
- Inventor: Carlos B. W. Garcia , M. Jeffery Igelman , Paul David Schweitzer
- Applicant: Carlos B. W. Garcia , M. Jeffery Igelman , Paul David Schweitzer
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
An electrical connection is encapsulated by dispensing an encapsulant on a first side of the electrical connection only, and directing the encapsulant to a second side of the electrical connection from the first side, where the second side generally faces opposite the first side.
Public/Granted literature
- US20070093001A1 Encapsulating electrical connections Public/Granted day:2007-04-26
Information query
IPC分类:
