Invention Grant
US07691680B2 Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
有权
使用具有较小厚度内部长度的引线框架制造微电子部件组件的方法
- Patent Title: Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
- Patent Title (中): 使用具有较小厚度内部长度的引线框架制造微电子部件组件的方法
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Application No.: US12108396Application Date: 2008-04-23
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Publication No.: US07691680B2Publication Date: 2010-04-06
- Inventor: Chee Peng Neo , Hock Chuan Tan , Beng Chye Chew , Yih Ming Chai , Kian Shing Tan
- Applicant: Chee Peng Neo , Hock Chuan Tan , Beng Chye Chew , Yih Ming Chai , Kian Shing Tan
- Applicant Address: US ID Boise
- Assignee: Micron Technologies, Inc.
- Current Assignee: Micron Technologies, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Priority: SG200301338-0 20030304
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/495 ; H01R43/00 ; H05K3/02
Abstract:
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, at least two leads, and at least two bond wires. Each of the leads may have a reduced-thickness inner length adjacent terminals of the microelectronic component and a body having an outer surface spaced farther from the microelectronic component than a bond surface of the inner length. Each of the bond wires couples the microelectronic component to one of the leads and has a maximum height outwardly from the microelectronic component that is no greater than the height of the outer surface of the lead.
Public/Granted literature
- US20080233684A1 MICROELECTRONIC COMPONENT ASSEMBLIES EMPLOYING LEAD FRAMES HAVING REDUCED-THICKNESS INNER LENGTHS Public/Granted day:2008-09-25
Information query
IPC分类:
