Chip scale package having flip chip interconnect on die paddle

Invention Grant

US07691681B2 Chip scale package having flip chip interconnect on die paddle 有权

Title translation: 芯片级封装，在芯片上具有倒装芯片互连

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Patent Title: Chip scale package having flip chip interconnect on die paddle
Patent Title (中): 芯片级封装，在芯片上具有倒装芯片互连
Application No.: US12191542

Application Date: 2008-08-14
Publication No.: US07691681B2

Publication Date: 2010-04-06
Inventor: Cheonhee Lee
Applicant: Cheonhee Lee
Applicant Address: US CA Fremont
Assignee: ChipPAC, Inc.
Current Assignee: ChipPAC, Inc.
Current Assignee Address: US CA Fremont
Agent Robert D. Atkins
Main IPC: H01L21/00
IPC: H01L21/00

Chip scale package having flip chip interconnect on die paddle

Abstract:

A flip chip lead frame package includes a die and a lead frame having a die paddle and leads, and has interconnection between the active site of the die and the die paddle. Also, methods for making the package are disclosed.

Abstract(Chinese):

倒装芯片引线框架封装包括管芯和具有管芯焊盘和引线的引线框架，并且在管芯的活性部位和管芯焊盘之间具有互连。此外，公开了制造包装的方法。

Public/Granted literature

US20080299705A1 Chip Scale Package Having Flip Chip Interconnect on Die Paddle Public/Granted day:2008-12-04

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备