Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11579141Application Date: 2005-05-16
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Publication No.: US07691686B2Publication Date: 2010-04-06
- Inventor: Kazuo Nishi , Junya Maruyama , Naoto Kusumoto , Yuusuke Sugawara
- Applicant: Kazuo Nishi , Junya Maruyama , Naoto Kusumoto , Yuusuke Sugawara
- Applicant Address: unknown Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: unknown Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2004-152160 20040521
- International Application: PCT/JP2005/009285 WO 20050516
- International Announcement: WO2005/114749 WO 20051201
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/84

Abstract:
An object of the present invention to provide a semiconductor device manufactured in short time by performing the step of forming the thin film transistor and the step of forming the photoelectric conversion layer in parallel, and to provide a manufacturing process thereof. According to the present invention, a semiconductor device is manufactured in such a way that a thin film transistor is formed over a first substrate, a photoelectric conversion element is formed over a second substrate, and the thin film transistor and the photoelectric conversion element are connected electrically by sandwiching a conductive layer between the first and second substrates opposed to each other so that the thin film transistor and the photoelectric conversion element are located between the first and second substrates. Thus, a method for manufacturing a semiconductor device which suppresses the increase in the number of steps and which increases the throughput can be provided.
Public/Granted literature
- US20080001148A1 Semiconductor Device and Manufacturing Method Thereof Public/Granted day:2008-01-03
Information query
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