Invention Grant
US07691687B2 Method for processing laser-irradiated thin films having variable thickness
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用于处理具有可变厚度的激光照射薄膜的方法
- Patent Title: Method for processing laser-irradiated thin films having variable thickness
- Patent Title (中): 用于处理具有可变厚度的激光照射薄膜的方法
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Application No.: US11651305Application Date: 2007-01-09
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Publication No.: US07691687B2Publication Date: 2010-04-06
- Inventor: James S. Im
- Applicant: James S. Im
- Applicant Address: US NY New York
- Assignee: The Trustees of Columbia University in the City of New York
- Current Assignee: The Trustees of Columbia University in the City of New York
- Current Assignee Address: US NY New York
- Agency: Wilmer Cutler Pickering Hale and Dorr LLP
- Main IPC: H01L21/84
- IPC: H01L21/84 ; H01L21/00
Abstract:
A crystalline film includes a first crystalline region having a first film thickness and a first crystalline grain structure; and a second crystalline region having a second film thickness and a second crystalline grain structure. The first film thickness is greater than the second film thickness and the first and second film thicknesses are selected to provide a crystalline region having the degree and orientation of crystallization that is desired for a device component.
Public/Granted literature
- US20070111349A1 Laser-irradiated thin films having variable thickness Public/Granted day:2007-05-17
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