Invention Grant
- Patent Title: Semiconductor device having a capacitance element and method of manufacturing the same
- Patent Title (中): 具有电容元件的半导体器件及其制造方法
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Application No.: US11923062Application Date: 2007-10-24
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Publication No.: US07691743B2Publication Date: 2010-04-06
- Inventor: Naruhiko Nakanishi
- Applicant: Naruhiko Nakanishi
- Applicant Address: JP Tokyo
- Assignee: Elpida Memory, Inc.
- Current Assignee: Elpida Memory, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2006-290673 20061026; JP2007-263138 20071009
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L31/119

Abstract:
A dielectric film is formed by depositing an amorphous strontium oxide film to a thickness of one to several atomic layers on a first electrode layer, then depositing an amorphous titanium oxide film to a thickness of one to several atomic layers on the amorphous strontium oxide film, and then heat-treating a laminated film of the amorphous strontium oxide film and the amorphous titanium oxide film at a temperature close to a crystallization start temperature, thereby converting the laminated film to a single-layer amorphous strontium titanate film containing a plurality of crystal grains therein. The laminated film may have a plurality of amorphous strontium oxide films and a plurality of amorphous titanium oxide films that are alternately laminated. A semiconductor device includes a capacitor having as its dielectric film a single-layer amorphous strontium titanate film containing a plurality of crystal grains therein.
Public/Granted literature
- US20080099809A1 SEMICONDUCTOR DEVICE HAVING A CAPACITANCE ELEMENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2008-05-01
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