Moulding compound, comprising 30 to 80% by weight of a polyamide as a thermoplastic matrix and of a cross-linked, disperse elastomer phase which is bonded to the thermoplastic matrix and contains 10 to 69% by weight of an ethylene copolymer and also 1 to 10% by weight of a compatibility agent, selected from the compounds obtained by means of grafting of α, β, ethylene-unsaturated mono- and/or dicarboxylic acids or derivatives thereof on an ethylene-copolymer-polymer backbone, respectively relative to the moulding compound.