Invention Grant
- Patent Title: Thermal conductive silicone composition
- Patent Title (中): 导热硅胶组合物
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Application No.: US10567587Application Date: 2004-09-29
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Publication No.: US07692032B2Publication Date: 2010-04-06
- Inventor: Chisato Hoshino
- Applicant: Chisato Hoshino
- Applicant Address: JP Tokyo
- Assignee: Momentive Performance Materials Japan LLC
- Current Assignee: Momentive Performance Materials Japan LLC
- Current Assignee Address: JP Tokyo
- Agency: Flynn, Thiel, Boutell & Tanis, P.C.
- Priority: JP2003-337806 20030929
- International Application: PCT/JP2004/014679 WO 20040929
- International Announcement: WO2005/030874 WO 20050407
- Main IPC: C07F7/00
- IPC: C07F7/00

Abstract:
The present invention relates to a thermal conductive silicone composition containing a siloxane which contains a hydrolytic group represented by the formula (1): where R1 is a group containing an alkoxysilyl group having 1 to 4 carbon atoms, R2 is a siloxy represented by the following formula (2) or a monovalent hydrocarbon group having 6 to 18 carbon atoms, X is a divalent hydrocarbon group having 2 to 10 carbon atoms, a and b are integers of 1 or more, c is an integer of 0 or more, the sum of a+b+c is an integer of 4 or more, R3 is a monovalent hydrocarbon group having 1 to 6 carbon atoms or a hydrogen atom, provided that R3s may be the same as or different from each other; R4 is a monovalent hydrocarbon group having 1 to 12 carbon atoms, Y is a group selected from a methyl group, a vinyl group and R1, and d is an integer of 2 to 500.
Public/Granted literature
- US20070185259A1 Thermal conductive silicone composition Public/Granted day:2007-08-09
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