Invention Grant
- Patent Title: Electronic circuit device
- Patent Title (中): 电子电路装置
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Application No.: US11195719Application Date: 2005-08-03
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Publication No.: US07692102B2Publication Date: 2010-04-06
- Inventor: Yoshiteru Kawakami , Yasuharu Nakamura
- Applicant: Yoshiteru Kawakami , Yasuharu Nakamura
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2004-234052 20040811
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
An electronic circuit device includes at least two circuit substrates for mounting electronic components and a flexible board for external electrical connection disposed between the circuit substrates. The flexible board is electrically connected to at least the surface of one circuit substrate opposed to another circuit substrate.
Public/Granted literature
- US20060032669A1 Electronic circuit device Public/Granted day:2006-02-16
Information query
