Invention Grant
US07692115B2 Laser processing device, laser processing head and laser processing method
有权
激光加工装置,激光加工头和激光加工方法
- Patent Title: Laser processing device, laser processing head and laser processing method
- Patent Title (中): 激光加工装置,激光加工头和激光加工方法
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Application No.: US11933719Application Date: 2007-11-01
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Publication No.: US07692115B2Publication Date: 2010-04-06
- Inventor: Yoshinari Sasaki , Kosei Aso , Hidehisa Murase , Naoki Yamada
- Applicant: Yoshinari Sasaki , Kosei Aso , Hidehisa Murase , Naoki Yamada
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sonnenschein Nath & Rosenthal LLP
- Priority: JP2006-299526 20061102
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23K26/12

Abstract:
Disclosed is a laser processing device. The laser processing device includes a laser beam source irradiating a laser beam, and a laser processing head. The laser processing head includes a transmitting window through which the laser beam passes, an aperture formed in a bottom of the laser head and allowing the laser beam to pass through via the transmitting window, an introducing hole introducing a gas into the laser processing head, and an exhausting hole discharging a gas in the laser processing head to outside. The laser processing head further includes a air hole introducing the gas to the periphery of the laser irradiating area, an air hole allowing to discharge the ambient gas of the laser irradiating area, and a masking shield having an opening placed between the transmitting window and the aperture, and an aerating portion communicated with the introducing hole and exhausting hole.
Public/Granted literature
- US20080210675A1 LASER PROCESSING DEVICE, LASER PROCESSING HEAD AND LASER PROCESSING METHOD Public/Granted day:2008-09-04
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