Invention Grant
- Patent Title: Thermal sensor with thermal barrier
- Patent Title (中): 热传感器带热障
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Application No.: US11584733Application Date: 2006-10-20
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Publication No.: US07692148B2Publication Date: 2010-04-06
- Inventor: William A. Lane , Eamon Hynes , Edward John Coyne
- Applicant: William A. Lane , Eamon Hynes , Edward John Coyne
- Applicant Address: US MA Norwood
- Assignee: Analog Devices, Inc.
- Current Assignee: Analog Devices, Inc.
- Current Assignee Address: US MA Norwood
- Agency: Knobbe, Martens, Olson & Bear LLP
- Main IPC: G01J5/00
- IPC: G01J5/00 ; G01J5/02
Abstract:
The invention provides a sensor element formed in a first substrate and having a thermal barrier disposed between the sensor element and a heat source provided elsewhere on the first substrate. The thermal barrier includes at least one pair of trenches formed within the first substrate, individual trenches of the pair being separated by a cavity.
Public/Granted literature
- US20070120060A1 Thermal sensor with thermal barrier Public/Granted day:2007-05-31
Information query
