Packaging designs for LEDs

Invention Grant

US07692207B2 Packaging designs for LEDs 有权

Title translation: LED封装设计

Patent Title: Packaging designs for LEDs
Patent Title (中): LED封装设计
Application No.: US11210013

Application Date: 2005-08-23
Publication No.: US07692207B2

Publication Date: 2010-04-06
Inventor: Alexei A. Erchak , Paul Panaccione , Robert F. Karlicek, Jr. , Michael Lim , Elefterios Lidorikis , Jo A. Venezia , Christian Hoepfner
Applicant: Alexei A. Erchak , Paul Panaccione , Robert F. Karlicek, Jr. , Michael Lim , Elefterios Lidorikis , Jo A. Venezia , Christian Hoepfner
Applicant Address: US MA Billerica
Assignee: Luminus Devices, Inc.
Current Assignee: Luminus Devices, Inc.
Current Assignee Address: US MA Billerica
Agency: Wolf, Greenfield & Sacks, P.C.
Main IPC: H01L23/14
IPC: H01L23/14

Abstract:

Light-emitting devices, and related components, processes, systems and methods are disclosed.

Abstract(Chinese):

公开了发光器件及相关部件，工艺，系统和方法。

Public/Granted literature

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/12	.安装架，例如不可拆卸的绝缘衬底
H01L23/14	..按其材料或它的电性能区分的