Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US12153217Application Date: 2008-05-15
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Publication No.: US07692241B2Publication Date: 2010-04-06
- Inventor: Takumi Shibata
- Applicant: Takumi Shibata
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2007-131504 20070517
- Main IPC: H01L49/00
- IPC: H01L49/00

Abstract:
A semiconductor device includes a semiconductor substrate and a super junction structure on the substrate. The super junction structure is constructed with p-type and n-type column regions that are alternately arranged. A p-type channel layer is formed to a surface of the super junction structure. A trench gate structure is formed to the n-type column region. An n+-type source region is formed to a surface of the channel layer near the trench structure. A p+-type region is formed to the surface of the channel layer between adjacent n+-type source regions. A p-type body region is formed in the channel layer between adjacent trench gate structures and in contact with the p+-type region. Avalanche current is caused to flow from the body region to a source electrode via the p+-type region without passing through the n+-type source region.
Public/Granted literature
- US20080283913A1 Semiconductor device Public/Granted day:2008-11-20
Information query
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