Invention Grant
US07692283B2 Device including a housing for a semiconductor chip including leads extending into the housing
有权
装置包括用于半导体芯片的壳体，其包括延伸到壳体中的引线
- Patent Title: Device including a housing for a semiconductor chip including leads extending into the housing
- Patent Title (中): 装置包括用于半导体芯片的壳体，其包括延伸到壳体中的引线
-
Application No.: US11938658Application Date: 2007-11-12
-
Publication No.: US07692283B2Publication Date: 2010-04-06
- Inventor: Michael Bauer , Holger Woerner , Simon Jerebic
- Applicant: Michael Bauer , Holger Woerner , Simon Jerebic
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102007050608 20071023
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L23/495
Abstract:
A device including a housing for a semiconductor chip is disclosed. One embodiment provides a plurality of leads. A first lead forms an external contact element at a first housing side and extends at the first housing side into the housing in the direction of an opposite second housing side. The length of the first lead within the housing is greater than half the distance between the first and the second housing side.
Public/Granted literature
- US20090102044A1 DEVICE INCLUDING A HOUSING FOR A SEMICONDUCTOR CHIP Public/Granted day:2009-04-23
Information query
IPC分类:
