Invention Grant
US07692288B2 MEMS packaging method for enhanced EMI immunity using flexible substrates
有权
使用柔性基板提高EMI抗扰度的MEMS封装方法
- Patent Title: MEMS packaging method for enhanced EMI immunity using flexible substrates
- Patent Title (中): 使用柔性基板提高EMI抗扰度的MEMS封装方法
-
Application No.: US11333579Application Date: 2006-01-17
-
Publication No.: US07692288B2Publication Date: 2010-04-06
- Inventor: Wang Zhe , Miao Yubo
- Applicant: Wang Zhe , Miao Yubo
- Applicant Address: SG Singapore
- Assignee: Silicon Matrix Pte Ltd.
- Current Assignee: Silicon Matrix Pte Ltd.
- Current Assignee Address: SG Singapore
- Agency: Saile Ackerman LLC
- Agent Stephen B. Ackerman; Rosemary L. S. Pike
- Main IPC: H01L23/12
- IPC: H01L23/12
Abstract:
A MEMS package and methods for its embodiment are described. The MEMS package has at least one MEMS device mounted on a flexible and foldable substrate. A metal cap structure surrounds the at least one MEMS device wherein an edge surface of the metal cap structure is attached to the flexible substrate and wherein a portion of the flexible substrate is folded under itself thereby forming the MEMS package. A meshed metal environmental hole underlying the at least one MEMS device provides enhanced EMI immunity.
Public/Granted literature
- US20070013052A1 MEMS packaging method for enhanced EMI immunity using flexible substrates Public/Granted day:2007-01-18
Information query
IPC分类:
