Invention Grant
- Patent Title: Heat slug and semiconductor package
- Patent Title (中): 散热片和半导体封装
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Application No.: US12251116Application Date: 2008-10-14
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Publication No.: US07692290B2Publication Date: 2010-04-06
- Inventor: Yun Lung Chang , Pin Hung Chiu , Chun Chen Liu
- Applicant: Yun Lung Chang , Pin Hung Chiu , Chun Chen Liu
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Priority: TW96146074A 20070412
- Main IPC: H01L23/10
- IPC: H01L23/10 ; H01L23/34
Abstract:
A heat slug includes a heat spreading member and a supporting member. The supporting member extends outwardly from the edge of the heat spreading member. The tips of the supporting member are formed with a plurality of contact portions, wherein each said contact portion has a bottom face inclined to the surface of the chip carrier art an angle of more that 5 degrees.
Public/Granted literature
- US20090039483A1 HEAT SLUG AND SEMICONDUCTOR PACKAGE Public/Granted day:2009-02-12
Information query
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