Invention Grant
- Patent Title: Packaged electronic element and method of producing electronic element package
- Patent Title (中): 封装电子元件和电子元件封装的制造方法
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Application No.: US10581792Application Date: 2004-12-02
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Publication No.: US07692292B2Publication Date: 2010-04-06
- Inventor: Kazushi Higashi , Shinji Ishitani
- Applicant: Kazushi Higashi , Shinji Ishitani
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack L.L.P.
- Priority: JP2003-407232 20031205; JP2003-410046 20031209; JP2003-420643 20031218
- International Application: PCT/JP2004/017931 WO 20041202
- International Announcement: WO2005/055317 WO 20050616
- Main IPC: H01L23/10
- IPC: H01L23/10
Abstract:
A first container member (9, 109, 212) mounting an electronic device (71, 171, 261) thereon and a second container member (2, 102, 202) are bonded with an adhesive (3, 103) or a metal layer (103, 251). Thus an inner space (90, 190, 211) is formed and the electronic device can be closed in the inner space at a low temperature. In the case the adhesive is used, an exposed surface of the adhesive is coated with a metal film (4) to improve the closeness of the inner space. Further, an electronic device (261, 272) may be mounted on the second container member so as to increase the electronic device arrangement density in a packaged electronic device.
Public/Granted literature
- US20070108634A1 Packaged electronic element and method of producing electronic element package Public/Granted day:2007-05-17
Information query
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