An integrated circuit package includes a substrate, first, second and third dies and an antenna. The substrate includes a first layer with electrical traces and a second layer substantially formed of a dielectric material. The first die includes a first integrated circuit. The second die includes a second integrated circuit electrically coupled through wire bonds to the integrated circuit on the substrate and mechanically coupled to the first die such that the first die is disposed between the substrate and the second die. The third die includes a third integrated circuit and is electrically coupled to the integrated circuit on the substrate. The antenna and the first, second and third integrated circuits substantially form a radio transceiver.