Invention Grant
- Patent Title: Semiconductor device, semiconductor device module and method of manufacturing the semiconductor device
- Patent Title (中): 半导体器件，半导体器件模块和半导体器件的制造方法
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Application No.: US11172783Application Date: 2005-07-05
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Publication No.: US07692297B2Publication Date: 2010-04-06
- Inventor: Takashi Miyazaki , Takuo Funaya
- Applicant: Takashi Miyazaki , Takuo Funaya
- Applicant Address: JP Kanagawa JP Tokyo
- Assignee: NEC Electronics Corporation,NEC Corporation
- Current Assignee: NEC Electronics Corporation,NEC Corporation
- Current Assignee Address: JP Kanagawa JP Tokyo
- Agency: Young & Thompson
- Priority: JP2004-201648 20040708
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A reliable semiconductor device including support bumps so as to adequately seal the region between the chips is to be provided. The semiconductor device includes a semiconductor chip; a bump formed on an upper face of the semiconductor chip; and a plurality of support bumps formed along a circumference of the region where the bump is provided, formed on the upper face of the semiconductor chip; and a flow path for a sealing resin is provided between the plurality of support bumps, so as to connect the region where the bump is provided and a periphery region of the semiconductor chip.
Public/Granted literature
- US20060012038A1 Semiconductor device, semiconductor device module and method of manufacturing the semiconductor device Public/Granted day:2006-01-19
Information query
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