Invention Grant
US07692298B2 III-V nitride semiconductor device comprising a concave shottky contact and an ohmic contact
有权
III-V族氮化物半导体器件包括凹形肖特基接触和欧姆接触
- Patent Title: III-V nitride semiconductor device comprising a concave shottky contact and an ohmic contact
- Patent Title (中): III-V族氮化物半导体器件包括凹形肖特基接触和欧姆接触
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Application No.: US10573458Application Date: 2005-08-25
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Publication No.: US07692298B2Publication Date: 2010-04-06
- Inventor: Koji Otsuka , Shinichi Iwakami
- Applicant: Koji Otsuka , Shinichi Iwakami
- Applicant Address: JP Saitama-ken
- Assignee: Sanken Electric Co., Ltd.
- Current Assignee: Sanken Electric Co., Ltd.
- Current Assignee Address: JP Saitama-ken
- Agency: Wood, Herron, Evans, L.L.P.
- Priority: JP2004-289248 20040930
- International Application: PCT/JP2005/015405 WO 20050825
- International Announcement: WO2006/038390 WO 20060413
- Main IPC: H01L23/48
- IPC: H01L23/48

Abstract:
A two-dimensional carrier is generated in the vicinity of an interface that is a hetero interface between a semiconductor layer and a semiconductor layer. Two concave portions are formed so as to extend from a primary surface as far as the interface. An electrode that is made of metal and provides a Schottky junction with the semiconductor layers is formed on a bottom surface and a side surface of the concave portion. An electrode that is made from metal and provides a low resistance contact with the semiconductor layers and is also in low resistance contact therewith is formed on the bottom surface and side surface of the concave portion. As a result, a semiconductor device is provided in which contact resistance between the electrodes and the semiconductor layers is reduced and high frequency characteristics are improved.
Public/Granted literature
- US20070051938A1 Semiconductor device Public/Granted day:2007-03-08
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