Invention Grant
US07692307B2 Compliant structure for an electronic device, method of manufacturing same, and system containing same
有权
用于电子设备的符合标准的结构，其制造方法和包含该装置的系统
- Patent Title: Compliant structure for an electronic device, method of manufacturing same, and system containing same
- Patent Title (中): 用于电子设备的符合标准的结构，其制造方法和包含该装置的系统
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Application No.: US11636250Application Date: 2006-12-08
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Publication No.: US07692307B2Publication Date: 2010-04-06
- Inventor: Sudarshan Rangaraj , Shankar Ganapathysubramanian , Richard Harries , Mitul Modi , Sankara J. Subramanian
- Applicant: Sudarshan Rangaraj , Shankar Ganapathysubramanian , Richard Harries , Mitul Modi , Sankara J. Subramanian
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent Kenneth A. Nelson
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A compliant structure for an electronic device comprises a substrate (110) composed of a first material (111) and a compliant zone (120) within the substrate. A plurality of solder joints (280) are located between, and form a connection between, the substrate and the electronic device (290). The compliant zone reduces the degree of deformation experienced by the solder joints due to thermal mismatch loading between the substrate and the die during attachment of the die to the substrate (chip attach). This reduction in solder joint deformation reduces the likelihood that the solder joints will crack.
Public/Granted literature
- US20080137318A1 Compliant structure for an electronic device, method of manufacturing same, and system containing same Public/Granted day:2008-06-12
Information query
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