Invention Grant
- Patent Title: Semiconductor device having reinforcement member and method of manufacturing the same
- Patent Title (中): 具有加强构件的半导体装置及其制造方法
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Application No.: US11477928Application Date: 2006-06-30
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Publication No.: US07692312B2Publication Date: 2010-04-06
- Inventor: Masato Sumikawa , Kazumi Tanaka
- Applicant: Masato Sumikawa , Kazumi Tanaka
- Applicant Address: JP Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2000-034855 20000214
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A semiconductor package providing with a printed circuit board and a semiconductor device, including a semiconductor substrate having a surface provided with an external connection electrode and mounted on the printed circuit board, and, a surface opposite that with said external connection electrode, abrased with a mirror finish and reinforced with a back-surface reinforcement.
Public/Granted literature
- US20060249853A1 Semiconductor device and method of manufacturing the same Public/Granted day:2006-11-09
Information query
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