Invention Grant
- Patent Title: Audio amplifier assembly
- Patent Title (中): 音频放大器组件
-
Application No.: US11239967Application Date: 2005-09-30
-
Publication No.: US07692316B2Publication Date: 2010-04-06
- Inventor: Jianjun Cao , Jorge Cerezo , Ajit Dubhashi , Qun Zhao
- Applicant: Jianjun Cao , Jorge Cerezo , Ajit Dubhashi , Qun Zhao
- Applicant Address: US CA El Segundo
- Assignee: International Rectifier Corporation
- Current Assignee: International Rectifier Corporation
- Current Assignee Address: US CA El Segundo
- Agency: Farjami & Farjami LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
An audio amplifier assembly that includes a semiconductor package having a semiconductor power die tuned for class D amplifier applications and a conductive clip used for low inductance integration into the amplifier circuit.
Public/Granted literature
- US20060087026A1 Audio amplifier assembly Public/Granted day:2006-04-27
Information query
IPC分类:
